DocumentCode :
2739612
Title :
Methods of Improving the Quality of X-Ray Image Reconstruction with Limited Projection Data
Author :
Shaw, Dominick ; Kao, Shih-Chao ; Chen, Shih-Liang
Author_Institution :
Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu
fYear :
2008
fDate :
22-24 Oct. 2008
Firstpage :
212
Lastpage :
215
Abstract :
Nowadays X-ray Nondestructive Testing ( NDT ) has played an important role in defect inspection but the X-ray image contains all the information the rays passed by, therefore, it is hard to inspect the inner defect of PCB correctly. The correct inspect is rely on an image reconstruction system. In this study, a X-ray image reconstruction algorism to inspect the defect in a Printed Circuit Board ( PCB ) is developed. The Algebraic Reconstruction Technique ( ART ) is used to reconstruct the vertical section image from the images of several different project angle, the images are from the Planar Computer Tomography ( PCT ) system for PCB. The X-ray is assumed to be parallel beam. The limited angle of projection in PCT reduces the image reconstruction quality. To improve the quality of reconstructed image, a method combines the binary steering mechanism with ART to get the correct convergence and avoiding the local optimum solution of ART is proposed. Furthermore, the computational algorism to increase the reconstructed speed and discussing the influence between the image and the noise of projection data are also discussed.
Keywords :
computerised tomography; image reconstruction; nondestructive testing; printed circuit testing; printed circuits; PCB; X-ray image reconstruction; X-ray nondestructive testing; algebraic reconstruction technique; limited projection angle; planar computer tomography; printed circuit board; Aging; Bismuth; Cities and towns; Image reconstruction; Intermetallic; Materials science and technology; Mechanical factors; Solid state circuits; Tin; X-ray imaging; Binary Steering Mechanism; Image Reconstruction; Tomography;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3623-1
Electronic_ISBN :
978-1-4244-3624-8
Type :
conf
DOI :
10.1109/IMPACT.2008.4783847
Filename :
4783847
Link To Document :
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