• DocumentCode
    2739623
  • Title

    "True Water-Based Cleaning Innovations to Replace Solvent Based Defluxing Products"

  • Author

    Schweigart, Helmut ; Strixner, Stefan ; Wack, Harald

  • Author_Institution
    ZESTRON Eur., Ingolstadt
  • fYear
    2008
  • fDate
    22-24 Oct. 2008
  • Firstpage
    216
  • Lastpage
    219
  • Abstract
    The field of cleaning applications related to modern semiconductor production technologies covers very different types of substrates and tasks. Modern water-based cleaning technologies such as microphase cleaning (MPC) and fast acting surfactant technology (FAST) are used in defluxing after different manufacturing processes such as wafer bumping, flip-chip assembly and die-attach used for power modules and devices. The cleaning agents to be used for Semicon Backend applications should be water based and their chemical content should have the ability to remove different kinds of fluxes and solder pastes even from difficult areas at moderate process parameters. Lastly, the cleaning agents should be compatible for various polymers and metals and should have high loading capacity or bath life.
  • Keywords
    flip-chip devices; microassembling; power semiconductor devices; solders; surface cleaning; surfactants; bath life; cleaning agents; defluxing; die-attach; fast acting surfactant technology; flip-chip assembly; loading capacity; microphase cleaning; power devices; power modules; semiconductor production technologies; solder pastes; wafer bumping; water-based cleaning; Assembly; Chemical processes; Chemical technology; Cleaning; Manufacturing processes; Multichip modules; Production; Solvents; Substrates; Technological innovation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-3623-1
  • Electronic_ISBN
    978-1-4244-3624-8
  • Type

    conf

  • DOI
    10.1109/IMPACT.2008.4783848
  • Filename
    4783848