DocumentCode
2739623
Title
"True Water-Based Cleaning Innovations to Replace Solvent Based Defluxing Products"
Author
Schweigart, Helmut ; Strixner, Stefan ; Wack, Harald
Author_Institution
ZESTRON Eur., Ingolstadt
fYear
2008
fDate
22-24 Oct. 2008
Firstpage
216
Lastpage
219
Abstract
The field of cleaning applications related to modern semiconductor production technologies covers very different types of substrates and tasks. Modern water-based cleaning technologies such as microphase cleaning (MPC) and fast acting surfactant technology (FAST) are used in defluxing after different manufacturing processes such as wafer bumping, flip-chip assembly and die-attach used for power modules and devices. The cleaning agents to be used for Semicon Backend applications should be water based and their chemical content should have the ability to remove different kinds of fluxes and solder pastes even from difficult areas at moderate process parameters. Lastly, the cleaning agents should be compatible for various polymers and metals and should have high loading capacity or bath life.
Keywords
flip-chip devices; microassembling; power semiconductor devices; solders; surface cleaning; surfactants; bath life; cleaning agents; defluxing; die-attach; fast acting surfactant technology; flip-chip assembly; loading capacity; microphase cleaning; power devices; power modules; semiconductor production technologies; solder pastes; wafer bumping; water-based cleaning; Assembly; Chemical processes; Chemical technology; Cleaning; Manufacturing processes; Multichip modules; Production; Solvents; Substrates; Technological innovation;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
Conference_Location
Taipei
Print_ISBN
978-1-4244-3623-1
Electronic_ISBN
978-1-4244-3624-8
Type
conf
DOI
10.1109/IMPACT.2008.4783848
Filename
4783848
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