Title :
Nondestructive Testing of Paint Thickness Measurement by Pulsed Infrared Thermography
Author :
Bo, LIU ; Cun-Lin, Zhang ; Jing-ling, Shen ; Li-chun, Feng ; Ning, Tao ; Yan-hong, Li ; You-fu, Ding ; Si-chao, Shi ; Yi-guang, Xu ; Yan, Huo ; Shi-bin, Zhao ; Wei-chao, Xu ; Xiao-Yan, Zhang
Author_Institution :
Capital Normal Univ., Beijing
Abstract :
In this paper, basic principles of active IR thermography are introduced, paints covered sample is excited by exterior energy with ordinary flashing lamps array, the subsequent change of surface temperature of the sample is monitored by an infrared camera, and sequence of thermal wave signal and data acquisition are processed using the computer, then real-time image signal processing and the analysis were carried on by the special software. Finally using the algorithm, the paint level thickness information can be obtained. The setup of IR NDT system and the new heat excitation-device were presented, especially including creation of key part, i.e. the heat excitation-device which was invented by self in laboratory. Comparing with heating equipment of thermal wave imaging (TWI) imported from US, it has some merits such as lower expense, narrower pulse width, lower power loss and so on.
Keywords :
heat conduction; infrared imaging; nondestructive testing; paints; thickness measurement; IR NDT system; data acquisition; heat excitation-device; heating equipment; infrared camera; nondestructive testing; ordinary flashing lamps array; paint sample surface temperature; paint thickness measurement; pulsed infrared thermography; real-time image signal processing; thermal wave imaging; thermal wave signal sequence; Computerized monitoring; Lamps; Nondestructive testing; Paints; Photothermal effects; Pulse measurements; Signal processing algorithms; Surface waves; Temperature; Thickness measurement; NDT; Paint thickness; Pulsed IR thermography;
Conference_Titel :
Infrared Millimeter Waves and 14th International Conference on Teraherz Electronics, 2006. IRMMW-THz 2006. Joint 31st International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0400-2
Electronic_ISBN :
1-4244-0400-2
DOI :
10.1109/ICIMW.2006.368531