Title :
High thermal resistant polyimide coating applications on intelligent electronic devices
Author :
Itabashi, Toshiaki
Author_Institution :
DuPont Electron. Center, KSP, Kawasaki
Abstract :
Since starting high volume production of plastic mold packaging for IC/LSI, polyimide coatings has been using as of reliable passivation stress buffer (PSB) layer with over 20years history. The times have changed, modified / customize designed polyimide coatings are added more functionality resulting innovate usage and applications in electronics industry. This paper is examine variety of polyimide application examples and molecular design concept for control end properties, functionalities e.g. residual stress, Cu compatibility examples of new application and requirements. Also examine new adhesive concept and test results for 3D integrated package application.
Keywords :
adhesion; buffer layers; electronics packaging; integrated circuit packaging; internal stresses; moulding; passivation; plastic packaging; polymer films; reliability; 3D integrated package application; Cu compatibility; IC-LSI; adhesion strength; device reliability; electronic industry; high thermal resistant polyimide coating; intelligent electronic devices; plastic mold packaging; reliable passivation stress buffer layer; residual stress; Coatings; Electronic packaging thermal management; Large scale integration; Passivation; Plastic integrated circuit packaging; Polyimides; Production; Residual stresses; Thermal resistance; Thermal stresses;
Conference_Titel :
Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3623-1
Electronic_ISBN :
978-1-4244-3624-8
DOI :
10.1109/IMPACT.2008.4783856
