Title :
Thermal stress in thin films using real-time holographic interferometry
Author :
Ramprasad, B.S. ; Radha, T.S.
Author_Institution :
Indian Inst. of Sci., Bangalore, India
Abstract :
A study has been undertaken to set up a novel technique of measurement of thermal stress of thin films using real-time holographic interferometry. Using this technique thermal stress in conductive coatings has been studied and some results on iron and copper films are presented
Keywords :
computerised instrumentation; copper; holographic interferometry; iron; metallic thin films; nondestructive testing; stress measurement; thermal stresses; Cu; Fe; conductive coatings; real-time holographic interferometry; thermal stresses; thin films;
Conference_Titel :
Holographic Systems, Components and Applications, 1989., Second International Conference on
Conference_Location :
Bath
