Title :
Bump Design Optimization for Copper Pillar FCBGA Package
Author :
Lin, Tsung-shu ; Chen, K.M. ; Hu, Yen-chang ; Jiang, Yih-jenn
Author_Institution :
United Microelectron. Co., Hsinchu
Abstract :
An interfacial delamination between the under bump metallurgy (UBM) and the aluminum (Al) pad was observed in a Cu pillar bump (CPB) experiment. Finite element analysis was employed to study the failure mechanism and bump design optimization. Simulation result shows that CPB sustains largest tensile stress during thermal cycling test. Larger diameter pillar can reduce this tensile stress significantly at high temperature environment and confirmed by an evaluation experiment.
Keywords :
aluminium; copper; electronics packaging; failure (mechanical); finite element analysis; optimisation; tensile testing; Al; Cu; aluminum pad; bump design optimization; copper pillar FCBGA package; failure mechanism; finite element analysis; interfacial delamination; tensile stress; thermal cycling test; under bump metallurgy; Aluminum; Copper; Delamination; Design optimization; Failure analysis; Finite element methods; Packaging; Tensile stress; Testing; Thermal stresses;
Conference_Titel :
Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3623-1
Electronic_ISBN :
978-1-4244-3624-8
DOI :
10.1109/IMPACT.2008.4783870
