Title :
Computer Simulation of Aluminium Wirebonds with Globtop in Power Electronics Modules
Author :
Hua Lu ; Loh, Wei-Sun ; Bailey, Chris ; Johnson, C. Mark
Author_Institution :
Sch. of Comput. & Math. Sci., Univ. Of Greenwich, London
Abstract :
In this paper, computer modelling techniques are used to analyse the effects of globtops on the reliability of aluminium wirebonds in power electronics modules under cyclic thermal-mechanical loading conditions. The sensitivity of the wirehond reliability to the changes of the geometric and the material property parameters of wirebond globtop are evaluated and the optimal combination of the Young´s modulus and the coefficient of thermal expansion have been predicted.
Keywords :
Young´s modulus; aluminium; lead bonding; thermal expansion; thermomechanical treatment; Al; Young´s modulus; aluminium wirebonds; computer simulation; cyclic thermal-mechanical loading conditions; globtop; power electronics modules; reliability; thermal expansion; Aerospace materials; Aluminum; Computer simulation; Conducting materials; Material properties; Multichip modules; Power electronics; Semiconductor materials; Thermal expansion; Wire;
Conference_Titel :
Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3623-1
Electronic_ISBN :
978-1-4244-3624-8
DOI :
10.1109/IMPACT.2008.4783883
