DocumentCode
2740267
Title
Computer Simulation of Aluminium Wirebonds with Globtop in Power Electronics Modules
Author
Hua Lu ; Loh, Wei-Sun ; Bailey, Chris ; Johnson, C. Mark
Author_Institution
Sch. of Comput. & Math. Sci., Univ. Of Greenwich, London
fYear
2008
fDate
22-24 Oct. 2008
Firstpage
348
Lastpage
351
Abstract
In this paper, computer modelling techniques are used to analyse the effects of globtops on the reliability of aluminium wirebonds in power electronics modules under cyclic thermal-mechanical loading conditions. The sensitivity of the wirehond reliability to the changes of the geometric and the material property parameters of wirebond globtop are evaluated and the optimal combination of the Young´s modulus and the coefficient of thermal expansion have been predicted.
Keywords
Young´s modulus; aluminium; lead bonding; thermal expansion; thermomechanical treatment; Al; Young´s modulus; aluminium wirebonds; computer simulation; cyclic thermal-mechanical loading conditions; globtop; power electronics modules; reliability; thermal expansion; Aerospace materials; Aluminum; Computer simulation; Conducting materials; Material properties; Multichip modules; Power electronics; Semiconductor materials; Thermal expansion; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
Conference_Location
Taipei
Print_ISBN
978-1-4244-3623-1
Electronic_ISBN
978-1-4244-3624-8
Type
conf
DOI
10.1109/IMPACT.2008.4783883
Filename
4783883
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