CAE Analysis for Molding Design of Microchip Encapsulation

Semiconductor industry is one of the most important industries in Taiwan for more than one decade. The development of microchip product is complicated due to the complexity of material properties while processing. During fabrication, various problems such as wire sweep and paddle shift causing defects will happen. Traditionally, people would get rid of those problems by means of "trial-and-error". However, it is not so easy and effective. Recently, using CAE technology in the development of microchip encapsulation process is becoming more and more popular. CAE technology provides a more scientific way to help people solving the problems and enhance the development. In this paper, the true 3D CAE software, Moldex3D, is adopted to evaluate the design of microchip encapsulation. As an integrated technology to connect pre-process, filling and curing analyses, structure analysis and post-process, it gives a comprehensive solution for microchip encapsulation. The results of wire sweep and paddle shift analyses can provide good guideline for the microchip encapsulation development. By using this integrated CAE technology, the physical phenomenon for different molding design of microchip encapsulation can be easily obtained and therefore the most desired design will be found painlessly.