DocumentCode
2740416
Title
Single-event effects test results of 512MB SDRAMs
Author
Langley, T. ; Koga, R. ; Morris, T.
Author_Institution
SEAKR Eng. Inc., Centennial, CO, USA
fYear
2003
fDate
21-25 July 2003
Firstpage
98
Lastpage
101
Abstract
Single-event effect test results of new 512MB SDRAMs are reported in this paper. Effects characterized during testing include single-event upset, single-event latchup, and single-event functional interrupt. Upset cross-sections are compared with radiation test results of earlier generation SDRAMs as a feasibility assessment for use of these new technologies.
Keywords
DRAM chips; integrated circuit testing; radiation effects; 512 MB; SDRAM; SEE test results; feasibility assessment; radiation test results; single-event effects; single-event functional interrupt; single-event latchup; single-event upset; synchronous dynamic random access memory; upset cross-sections; Aerospace testing; Cyclotrons; Performance evaluation; Protons; Radiation effects; SDRAM; Single event upset; Space technology; System testing; Telephony;
fLanguage
English
Publisher
ieee
Conference_Titel
Radiation Effects Data Workshop, 2003. IEEE
Print_ISBN
0-7803-8127-0
Type
conf
DOI
10.1109/REDW.2003.1281355
Filename
1281355
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