Title :
Horizontal Reel to Reel Copper Plating with InPulse 2
Author :
Kenny, Stephen ; Kostouros, Demitry
Author_Institution :
Atotech Deutschland GmbH, Berlin
Abstract :
This paper presents the latest innovation in the Inpulse 2 plating system which has been modified to allow reel to reel processing. Reel to reel plating is a standard technology for production of thin core flexible material where the substrate is treated as a continuous roll and where material handling is critical to ensure uniform results. The Inpulse 2 system uses insoluble anodes and a novel copper replenishment system to ensure uniform working conditions. The electrolyte agitation is managed by use of frequency controlled pumps which is critical for thin materials to ensure no surface damage during plating. The electrical contact to the substrate is made by the use of large contact area clamps along one edge of the material to be plated. This combination of features in the equipment allow the use of high production current densities even with flexible base materials with thin conductive layers. The clamping system at one edge of the material allows varying foil widths with no further equipment modifications necessary. The use of segmented insoluble anodes with individually controlled rectification is critical for thin flexible production to ensure optimum copper plated surface distribution. Results are shown from the production system being used to copper plate flexible material which is currently in production. The substrate has laser drilled through vias which are metallised and subsequently through hole copper plated in the reel to reel system.
Keywords :
copper; current density; electrical contacts; electrolytes; electroplating; materials handling; Cu; Inpulse 2 plating system; copper replenishment; current density; electrical contact; electrolyte agitation; horizontal reel-reel copper plating; insoluble anodes; material handling; thin core flexible material; Anodes; Clamps; Conducting materials; Contacts; Continuous production; Copper; Employee welfare; Materials handling; Production systems; Technological innovation;
Conference_Titel :
Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3623-1
Electronic_ISBN :
978-1-4244-3624-8
DOI :
10.1109/IMPACT.2008.4783897