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fYear

2008

fDate

22-24 Oct. 2008

Firstpage

422

Lastpage

423

Abstract

Contains an entry for each author and co-author included in this conference proceedings record.

fLanguage

English

Publisher

ieee

Conference_Titel

Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International

Conference_Location

Taipei

Print_ISBN

978-1-4244-3623-1

Type

conf

DOI

10.1109/IMPACT.2008.4783903

Filename

4783903

Link To Document