• DocumentCode
    2741024
  • Title

    High performance 0.1 μm partially depleted SOI CMOSFET

  • Author

    Yeh, W.K. ; Huang, Chiutsung ; Chen, T.F. ; Hsu, S.M. ; Liu, Jiann ; Lin, C.H. ; Liou, F.T.

  • Author_Institution
    Dept. for Electr. Eng., Kaohsiung Natl. Univ., Taiwan
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    68
  • Lastpage
    69
  • Abstract
    The partially depleted SOI MOSFET (PD-SOI) has been found to be an attractive device due to advantages such as full dielectric isolation and reduced junction capacitance compared to the bulk Si device (Assaderaghi et al, 1997; Maeda et al, 2000). However, the floating body effect occurs on PD-SOI devices, resulting in threshold voltage reduction and noise overshoot (Tseng et al, 1997). Body contact structures have been proposed to improve the floating body effect (Huang et al, 1998). This paper describes high performance 0.1 μm generation SOI MOSFET technology with body contact structure (BC-SOI) which was used to investigate the device characteristics as well as thermal effects in comparison with the floating body SOI MOSFET (FB-SOI), which is without body contact. The dynamic-threshold voltage SOI MOSFET (DTMOS) was also investigated
  • Keywords
    CMOS integrated circuits; MOSFET; isolation technology; semiconductor device measurement; semiconductor device noise; silicon-on-insulator; 0.1 micron; BC-SOI; DTMOSFET; FB-SOI; PD-SOI; PD-SOI devices; SOI MOSFET technology; Si-SiO2; body contact; body contact structure; body contact structures; device characteristics; dielectric isolation; dynamic-threshold voltage SOI MOSFET; floating body SOI MOSFET; floating body effect; junction capacitance; noise overshoot; partially depleted SOI CMOSFET; partially depleted SOI MOSFET; thermal effects; threshold voltage reduction; CMOSFETs; Capacitance; Delay; MOSFET circuits; Ring oscillators; Scattering; Temperature dependence; Temperature sensors; Testing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 2000 IEEE International
  • Conference_Location
    Wakefield, MA
  • ISSN
    1078-621X
  • Print_ISBN
    0-7803-6389-2
  • Type

    conf

  • DOI
    10.1109/SOI.2000.892773
  • Filename
    892773