• DocumentCode
    2741357
  • Title

    Measurement and simulation of the sensitivity of terahertz frequency range passive flter elements to overlaid dielectrics

  • Author

    Wood, C. ; Cunningham, J. ; Tiang, C.K. ; Byrne, M. ; Hunter, I.C. ; Linfield, E.H. ; Davies, A.G.

  • Author_Institution
    Univ. of Leeds, Leeds
  • fYear
    2006
  • fDate
    18-22 Sept. 2006
  • Firstpage
    423
  • Lastpage
    423
  • Abstract
    Resonant terahertz filters in microstrip lines have been proposed as devices suitable for the detection of the properties of overlaid dielectric materials, with potential applications including the on-chip assay of DNA and other biological molecules. Here, we provide a direct comparison of numerical simulations to calibrated experimental data obtained on our resonant structures. We employ two different codes (HFSS and Sonnet) to cross-check the results of our numerical simulations, and conclude that stub-based THz band-stop filters offer an improvement in sensitivity (of order 100x) per unit active area compared with alternative designs. This is a result of the enhanced THz electric field concentration in the overlaid dielectric which this particular geometry produces.
  • Keywords
    band-stop filters; dielectric materials; microstrip filters; numerical analysis; passive filters; sensitivity analysis; submillimetre wave filters; DNA; band-stop filters; biological molecules; electric field concentration; microstrip lines; numerical simulations; overlaid dielectric materials; passive filter elements; resonant terahertz filters; terahertz frequency sensitivity; Biological system modeling; DNA; Dielectric materials; Dielectric measurements; Frequency measurement; Microstrip filters; Numerical simulation; Resonance; Submillimeter wave filters; Submillimeter wave measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Infrared Millimeter Waves and 14th International Conference on Teraherz Electronics, 2006. IRMMW-THz 2006. Joint 31st International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-0400-2
  • Electronic_ISBN
    1-4244-0400-2
  • Type

    conf

  • DOI
    10.1109/ICIMW.2006.368631
  • Filename
    4222365