• DocumentCode
    2741655
  • Title

    Computer Integrated Plasma Nano Manufacturing Workcell

  • Author

    Zhang, Jiangbo ; Lai, King W C ; Narendra, Jeffri ; Xi, Ning ; Grotjohn, Timothy ; Asmussen, Jes

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI
  • fYear
    2008
  • fDate
    18-21 Aug. 2008
  • Firstpage
    861
  • Lastpage
    864
  • Abstract
    As a very important material processing technology, plasma processing is able to modify sample surface through etching, deposition, activation, functionalization, polymerization, etc. However, the general plasma processing reacts on a large area of sample surface. Hence a mask is needed for selectively treating the sample surface. In this paper, a computer integrated plasma nano manufacturing workcell is developed, which consists of a micro plasma source and an integrated Atomic Force Microscopy (AFM) nanomanipulation system. The miniature microwave plasma discharge applicator is able to create a miniature plasma stream with a diameter ranges from 2 millimeters down to micrometers. Hence the micro plasma will be able to locally treat a sample surface and has the potential to eliminate the requirement of masks. With the integrated AFM system, the sample surface is able to be inspected and further modified at nanoscale in the same chamber after machined by the micro plasma. The system design and implementation are presented in the paper. Experiments have been carried out to demonstrate the effectiveness of the system by locally etching a silicon substrate surface using the micro plasma source.
  • Keywords
    atomic force microscopy; computer integrated manufacturing; elemental semiconductors; masks; nanotechnology; plasma sources; silicon; sputter etching; Si; computer integrated plasma nanomanufacturing workcell; etching; integrated atomic force microscopy; mask; microplasma source; microwave plasma discharge applicator; nanomanipulation system; plasma material processing; plasma stream; polymerization; silicon substrate surface; Atomic force microscopy; Computer aided manufacturing; Computer integrated manufacturing; Etching; Plasma applications; Plasma materials processing; Plasma sources; Polymers; Surface discharges; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanotechnology, 2008. NANO '08. 8th IEEE Conference on
  • Conference_Location
    Arlington, TX
  • Print_ISBN
    978-1-4244-2103-9
  • Electronic_ISBN
    978-1-4244-2104-6
  • Type

    conf

  • DOI
    10.1109/NANO.2008.257
  • Filename
    4617239