• DocumentCode
    2742635
  • Title

    The influence of internal mechanical stresses on the GaAs-light-emitting diodes

  • Author

    Sidorov, V.G. ; Sokolov, V.I. ; Sidorov, D.V.

  • Author_Institution
    Dept. of Semicond. Phys. & Nanoelectron., St. Petersburg State Tech. Univ., Russia
  • fYear
    1997
  • fDate
    8-11 Sep 1997
  • Firstpage
    417
  • Lastpage
    420
  • Abstract
    The influence of internal mechanical stresses on design and performance of GaAs-LEDs is for the first time in detail investigated. The LED-structures were grown by liquid phase epitaxy from the melts doped with impurities of Si or Si and Sn simultaneously. The bending of crystal planes, internal friction, distribution of dislocations, and microhardness in p-n-junction regions have been measured. The value of internal mechanical stresses changes depending on concentration of doping impurities. When the internal mechanical stresses reach their minimum the LEDs perform the maximum value of quantum efficiency and maximum time of failure. The double Si and Sn doping is more effective. A qualitative model of all observed phenomena is offered
  • Keywords
    III-V semiconductors; dislocations; gallium arsenide; impurities; light emitting diodes; microhardness; semiconductor device models; semiconductor device reliability; semiconductor doping; silicon; tin; GaAs; GaAs:Si,Sn; LEDs; crystal planes bending; design; distribution of dislocations; doping impurities; double Si and Sn doping; failure; internal friction; internal mechanical stresses; light-emitting diodes; liquid phase epitaxy; microhardness; model; p-n-junction regions; performance; quantum efficiency; Epitaxial growth; Friction; Gallium arsenide; Impurities; Internal stresses; Light emitting diodes; Semiconductor devices; Semiconductor diodes; Substrates; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Compound Semiconductors, 1997 IEEE International Symposium on
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    0-7503-0556-8
  • Type

    conf

  • DOI
    10.1109/ISCS.1998.711675
  • Filename
    711675