• DocumentCode
    2743038
  • Title

    Wireless multichannel biopotential recording using an integrated FM telemetry circuit

  • Author

    Mohseni, P. ; Najafi, K.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
  • Volume
    2
  • fYear
    2004
  • fDate
    1-5 Sept. 2004
  • Firstpage
    4083
  • Lastpage
    4086
  • Abstract
    This paper reports on the design, implementation, and testing of wireless multichannel recording microsystems featuring on-chip AC amplification, DC input stabilization, time-division-multiplexing, and wireless FM reconstruction of input biopotentials with frequency contents from 0.05-6kHz with measured I/O correlation coefficients in the range of 70-94% per channel for spike train input amplitudes of 0.2-2mVp-p while dissipating only 2.2 mW from 3 V. The 4.84 mm2 IC is fabricated using AMI 1.5 μm 2P2M CMOS process, and is successfully interfaced with a micromachined silicon probe for simultaneous multichannel wireless in vitro recording of simulated neural spikes at 98MHz with measured I/O correlation coefficients of >80%.
  • Keywords
    CMOS integrated circuits; bioelectric potentials; biomedical telemetry; elemental semiconductors; frequency modulation; micromechanical devices; neurophysiology; silicon; time division multiplexing; 0.05 to 6 kHz; 2P2M CMOS process; 3 V; 98 MHz; DC input stabilization; Si; integrated FM telemetry circuit; micromachined silicon probe; neural spikes; on-chip AC amplification; time-division-multiplexing; wireless multichannel biopotential recording; Ambient intelligence; CMOS integrated circuits; CMOS process; Circuit testing; Frequency measurement; Integrated circuit measurements; Integrated circuit testing; Probes; Silicon; Telemetry; Multichannel biotelemetry; neural prostheses; neural recording; wireless FM microsystem;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2004. IEMBS '04. 26th Annual International Conference of the IEEE
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-8439-3
  • Type

    conf

  • DOI
    10.1109/IEMBS.2004.1404139
  • Filename
    1404139