DocumentCode :
2743426
Title :
A batch-manufacturable uniform current density metallic-shell hemispherical microelectrode
Author :
Guimont, Joe ; Ziaie, Babak
Author_Institution :
Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA
Volume :
2
fYear :
2004
fDate :
1-5 Sept. 2004
Firstpage :
4149
Lastpage :
4152
Abstract :
In this paper, we report on the simulation results for a batch-manufacturable uniform current density metallic-shell hemispherical microelectrode. These electrodes can be used for safe stimulation of neurons or neuromuscular junctions in a variety of research and clinical (neural prostheses) settings. Maxwell 3D™ software package was used to simulate several microelectrode structures capable of providing a uniform current density profile. These included recessed planar, solid-metallic and metallic-shell hemispherical microelectrodes. Simulation results showed no significant difference between the solid metallic and metallic-shell hemispherical electrodes with the latter being more compatible with the integrated circuit and MEMS microfabrication technologies. In addition, both hemispherical microelectrodes yield improved current density distribution and profile compared with the recessed planar electrode.
Keywords :
medical computing; microelectrodes; neuromuscular stimulation; prosthetics; MEMS microfabrication technologies; Maxwell 3D software package; batch-manufacturable uniform current density metallic-shell hemispherical microelectrode; integrated circuit; neural prostheses; neuromuscular junctions; neuron; recessed planar solid-metallic microelectrode; Circuit simulation; Current density; Electrodes; Microelectrodes; Micromechanical devices; Neuromuscular; Neurons; Prosthetics; Software packages; Solid modeling; Edge effect; Hemisphere electrode; Neuromuscular stimulation; Uniform current density;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society, 2004. IEMBS '04. 26th Annual International Conference of the IEEE
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-8439-3
Type :
conf
DOI :
10.1109/IEMBS.2004.1404157
Filename :
1404157
Link To Document :
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