• DocumentCode
    2743426
  • Title

    A batch-manufacturable uniform current density metallic-shell hemispherical microelectrode

  • Author

    Guimont, Joe ; Ziaie, Babak

  • Author_Institution
    Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA
  • Volume
    2
  • fYear
    2004
  • fDate
    1-5 Sept. 2004
  • Firstpage
    4149
  • Lastpage
    4152
  • Abstract
    In this paper, we report on the simulation results for a batch-manufacturable uniform current density metallic-shell hemispherical microelectrode. These electrodes can be used for safe stimulation of neurons or neuromuscular junctions in a variety of research and clinical (neural prostheses) settings. Maxwell 3D™ software package was used to simulate several microelectrode structures capable of providing a uniform current density profile. These included recessed planar, solid-metallic and metallic-shell hemispherical microelectrodes. Simulation results showed no significant difference between the solid metallic and metallic-shell hemispherical electrodes with the latter being more compatible with the integrated circuit and MEMS microfabrication technologies. In addition, both hemispherical microelectrodes yield improved current density distribution and profile compared with the recessed planar electrode.
  • Keywords
    medical computing; microelectrodes; neuromuscular stimulation; prosthetics; MEMS microfabrication technologies; Maxwell 3D software package; batch-manufacturable uniform current density metallic-shell hemispherical microelectrode; integrated circuit; neural prostheses; neuromuscular junctions; neuron; recessed planar solid-metallic microelectrode; Circuit simulation; Current density; Electrodes; Microelectrodes; Micromechanical devices; Neuromuscular; Neurons; Prosthetics; Software packages; Solid modeling; Edge effect; Hemisphere electrode; Neuromuscular stimulation; Uniform current density;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2004. IEMBS '04. 26th Annual International Conference of the IEEE
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-8439-3
  • Type

    conf

  • DOI
    10.1109/IEMBS.2004.1404157
  • Filename
    1404157