DocumentCode :
2743543
Title :
High speed high power AlGaN/GaN heterostructure field effect transistors with improved ohmic contacts
Author :
Chu, Kenneth K. ; Murphy, Michael J. ; Burm, Jinwook ; Schaff, William J. ; Eastman, Lester F. ; Botchkarev, Andrei ; Tang, Haipeng ; Morkoç, Hadis
Author_Institution :
Nat. Nanofabrication Facility, Cornell Univ., Ithaca, NY, USA
fYear :
1997
fDate :
8-11 Sep 1997
Firstpage :
427
Lastpage :
430
Abstract :
Ti/Al/Ti/Au ohmic contacts with low contact resistance (as low as 0.24 Ω mm) were used in fabricating short gate length modulation-doped field effect transistors on MBE-grown AlGaN/GaN layers. Maximum drain current achieved was above 1 A/mm with a transconductance of 182 mS/mm. RF measurements showed a maximum fτ of 35.9 GHz and an fMAX of 57.0 GHz, both achieved with 0.15 μm gate length. Simple analysis showed an electron saturation velocity of 1.3×107 cm/s in our device structure. Maximum gate-drain breakdown voltages for these devices were measured to be 30 to 35 V
Keywords :
III-V semiconductors; aluminium compounds; contact resistance; gallium compounds; ohmic contacts; power HEMT; 0.15 micron; 30 to 35 V; 35.9 to 57.0 GHz; AlGaN-GaN; MBE layer; RF characteristics; Ti-Al-Ti-Au; Ti/Al/Ti/Au ohmic contact; contact resistance; drain current; electron saturation velocity; gate-drain breakdown voltage; high speed high power AlGaN/GaN heterostructure field effect transistor; modulation doped field effect transistor; transconductance; Aluminum gallium nitride; Contact resistance; Electrical resistance measurement; Gallium nitride; Gold; HEMTs; MODFETs; Ohmic contacts; Radio frequency; Transconductance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Compound Semiconductors, 1997 IEEE International Symposium on
Conference_Location :
San Diego, CA
Print_ISBN :
0-7503-0556-8
Type :
conf
DOI :
10.1109/ISCS.1998.711681
Filename :
711681
Link To Document :
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