• DocumentCode
    2743862
  • Title

    Study of dry etching process using SF6 and CF4/O2 for Nb/NbxSi1−x/Nb Josephson-junction fabrication

  • Author

    Zhong, Qing ; Cao, Wenhui ; Li, Jinjin ; Zhong, Yuan ; Wang, Xueshen

  • Author_Institution
    Nat. Inst. of Metrol., Beijing, China
  • fYear
    2012
  • fDate
    1-6 July 2012
  • Firstpage
    46
  • Lastpage
    47
  • Abstract
    Both SF6 and CF4 are plasma chemistries that are often used during dry etching in fabricating the niobium Josephson junctions. This paper presents the preliminary experimental results of using these two etches on etching Nb/NbxSi1-x/Nb Josephson junctions in NIM.
  • Keywords
    Josephson effect; niobium; niobium alloys; silicon alloys; sputter etching; Josephson junction fabrication; Nb-NbxSi1-x-Nb; dry etching; plasma chemistry; Etching; Josephson junctions; Junctions; Niobium; Standards; Sulfur hexafluoride; CF4; ICP; Josephson junctions; NbSi; RIE; SF6; SNS; dry etch;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Precision Electromagnetic Measurements (CPEM), 2012 Conference on
  • Conference_Location
    Washington, DC
  • ISSN
    0589-1485
  • Print_ISBN
    978-1-4673-0439-9
  • Type

    conf

  • DOI
    10.1109/CPEM.2012.6250653
  • Filename
    6250653
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2743862