DocumentCode :
2743883
Title :
A new sparse technique for singular integral equations in electromagnetics
Author :
Liu, Y.W. ; Mei, K.K.
Author_Institution :
Dept. of Electron. Eng., City Univ. of Hong Kong, China
fYear :
2000
fDate :
12-15 Sept. 2000
Firstpage :
239
Lastpage :
240
Abstract :
A simple matrix composition technique, based on the concept of measured equation of invariance (MEI), is proposed to numerically thin the matrix from singular integral equations, such as method of moments (MoM). This technique is referred to as matrix decomposition by the MEI concept (MDMEI). Since sparse matrices have many advantages for saving storage and computing time for large-size problems, many efforts have been done to thin the full matrix generated by the MoM. In order to generate the sparse matrix with little additional work on any of a variety of existent MoM programs, the MDMEI method is proposed. In this paper, the MoM matrices for a variety of problems, such as electrostatic problems, wire antennas, and 2- and 3-D conducting object scattering can be easily thinned by MDMEI.
Keywords :
electric field integral equations; electrical engineering computing; electromagnetic wave scattering; invariance; magnetic field integral equations; matrix decomposition; method of moments; sparse matrices; 2D conducting object scattering; 3D conducting object scattering; dense matrix; electromagnetics; electrostatic problems; equation of invariance; matrix decomposition; method of moments; numerical thinning; scattered fields; simple matrix composition technique; singular integral equations; sparse matrices; sparse technique; surface current densities; wire antennas; Artificial intelligence; Bandwidth; Current density; Electromagnetic scattering; Integral equations; Iron; Matrix decomposition; Message-oriented middleware; Moment methods; Sparse matrices;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Infrared and Millimeter Waves, 2000. Conference Digest. 2000 25th International Conference on
Conference_Location :
Beijing, China
Print_ISBN :
0-7803-6513-5
Type :
conf
DOI :
10.1109/ICIMW.2000.893014
Filename :
893014
Link To Document :
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