Title :
Finite element analysis application to semiconductor devices
Author :
Schroen, Walter H. ; Blanton, Paul S. ; Edwards, Darvin R.
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
Abstract :
The application of finite-element analysis (FEA) to the package design of the integrated circuit is addressed. An overview is given of structured design and stress issues for packages, and fundamental FEA concepts are reviewed. Stress-sensitive test structures used by industry are described. Aspects of package design, namely surface shear stresses, die attach stresses, stresses within the plastic, and metal notching, are considered
Keywords :
finite element analysis; integrated circuit technology; packaging; reliability; semiconductor technology; stress effects; stress measurement; FEA; VLSI devices; die attach stresses; finite-element analysis; industry; integrated circuit; metal notching; package design; plastic; semiconductor devices; structured design; surface shear stresses; test structures; Application specific integrated circuits; Circuit testing; Finite element methods; Integrated circuit packaging; Microassembly; Plastic integrated circuit packaging; Plastic packaging; Semiconductor device packaging; Semiconductor devices; Stress;
Conference_Titel :
Dayton Chapter Symposium, 1988. Avionics Integrity Program., Ninth Annual IEEE/AESS
Conference_Location :
Dayton, OH
DOI :
10.1109/DAYTON.1988.76015
