DocumentCode :
2744292
Title :
Flexible and extendible neural stimulation/recording device based on cooperative multi-chip CMOS LSI architecture
Author :
Tokuda, Takashi ; Pan, Yi-Li ; Uehara, Akihiro ; Kagawa, Keiichiro ; Ohta, Jun ; Nunoshita, Masahiro
Author_Institution :
Graduate Sch. of Mater. Sci., Nara Inst. of Sci. & Technol., Japan
Volume :
2
fYear :
2004
fDate :
1-5 Sept. 2004
Firstpage :
4322
Lastpage :
4325
Abstract :
An LSI-based cooperative multi-chip neural stimulation/recording device is proposed and fabricated. The proposed multi-chip device consists of small (600 μm × 600 μm in the present design) intelligent neural stimulation/recording chips (unit chip). The unit chip has a neural stimulation/recording electrode array and individual control circuit. It can work with other unit chips cooperatively. One can configure any number of the unit chips as the multi-chip neural stimulation/recording device. Compared to conventional single-chip architecture, the proposed multi-chip architecture has advantages in thinness, mechanical strength and flexibility, and extendibility. That makes the multi-chip neural stimulation/ recording device more suitable for in vivo applications than conventional single-chip devices. Packaging technology for cooperative multi-chip device is also discussed. We developed a thin, flexible packaging technique for the multi-chip neural stimulation/recording device and LSI-compatible Pt/Au stacked biocompatible bump electrode.
Keywords :
CMOS integrated circuits; biomedical electrodes; gold; large scale integration; mechanical strength; neurophysiology; platinum; 600 mum; LSI-compatible Pt/Au stacked biocompatible bump electrode; Pt-Au; cooperative multi-chip CMOS LSI architecture; extendibility; mechanical strength; neural stimulation/recording electrode array; thin flexible packaging technique; CMOS technology; Circuits; Electrodes; Electronics packaging; Image sensors; In vitro; In vivo; Large scale integration; Neural prosthesis; Retina; LSI-based neural interface device; biocompatible packaging; electronics; multi-chip;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society, 2004. IEMBS '04. 26th Annual International Conference of the IEEE
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-8439-3
Type :
conf
DOI :
10.1109/IEMBS.2004.1404203
Filename :
1404203
Link To Document :
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