• DocumentCode
    2744346
  • Title

    Hybrid RF/IR transcutaneous telemetry for power and high-bandwidth data

  • Author

    Guillory, K.S. ; Misener, A.K. ; Pungor, A.

  • Author_Institution
    Cyberkinetics Inc., Salt Lake City, UT, USA
  • Volume
    2
  • fYear
    2004
  • fDate
    1-5 Sept. 2004
  • Firstpage
    4338
  • Lastpage
    4340
  • Abstract
    As neuroprosthetic control systems continue to advance and increase in channel density, there will be a constant need to deliver data at higher bandwidths in and out of the body. Currently, RF telemetry and inductive coupling are the most commonly used methods for transmitting power and electronic data between implants and external systems, and state of the art systems can deliver data rates up to hundreds of kilobits per second. However, it is difficult to operate implanted medical RF links at higher data rates due to electromagnetic compatibility (EMC) constraints. In this study, we investigate the potential for hybrid telemetry systems that use constant-frequency RF inductive links for power and transcutaneous infrared (IR) signals for data. We show that with commercially available infrared communication components, data rates of up to 40 Mbits per second can be transmitted out across 5 mm of skin with an internal device power dissipation under 100 mW.
  • Keywords
    biomedical telemetry; medical control systems; neurophysiology; optical communication equipment; prosthetics; skin; electromagnetic compatibility; high-bandwidth data; hybrid RF/IR transcutaneous telemetry; inductive coupling; neuroprosthetic control systems; skin; transcutaneous infrared signals; Bandwidth; Control systems; Electromagnetic compatibility; Implants; Neural prosthesis; Optical fiber communication; RF signals; Radio frequency; Skin; Telemetry; Electrodes; Electromagnetic Compatibility; Infrared; Neuroprostheses; RF; Telemetry; Trancutaneous;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2004. IEMBS '04. 26th Annual International Conference of the IEEE
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-8439-3
  • Type

    conf

  • DOI
    10.1109/IEMBS.2004.1404207
  • Filename
    1404207