DocumentCode :
2745278
Title :
Process Innovation For Future Semiconductor Industry
Author :
Ogirima, M.
Author_Institution :
Hitachi, Ltd.
fYear :
1993
fDate :
17-19 May 1993
Firstpage :
1
Lastpage :
5
Abstract :
During the last few years, the semiconductor industry has been gradually deviating from its traditional course. This change seems to be due to the diversification of market needs and to technical difficulties. To break through to future technological generations, new device and process concepts must be introduced . This paper discusses several innovative processes for future developments in the semiconductor industry, It suggests that material innovation is important for simplifying device structure and lowering costs.
Keywords :
Electronics industry; Large scale integration; Market research; Materials; Metallization; Random access memory;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, 1993. Digest of Technical Papers. 1993 Symposium on
Conference_Location :
Kyoto, Japan
Type :
conf
DOI :
10.1109/VLSIT.1993.760218
Filename :
760218
Link To Document :
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