DocumentCode :
2745550
Title :
Plasma Cladding of Ni60-SiC Cermet Coating on Hot Forging Die
Author :
Pan, Chenggang ; Wang, Huachang ; Zhou, Jialin
Author_Institution :
Sch. of Mater. Sci. & Eng., Wuhan Univ. of Technol., Wuhan, China
Volume :
2
fYear :
2010
fDate :
5-6 June 2010
Firstpage :
12
Lastpage :
15
Abstract :
In order to satisfy performance and long life requirements for hot forging die, Ni60-SiC cermet coating was prepared on the high speed steel W6M05Cr4V2 by plasma cladding technology. Metallurgical bonding coating with enough bonding strength was obtained after optimizing the cladding parameters. The clad coating composition, microstructure, microhardness and thermal physical parameters were analyzed by X-ray diffractometer (XRD), optical microscopy (OPM), microhardness tester, laser thermal constant tester and dynamic thermo-mechanical analysis. The experimental results show that Ni60-SiC cermet coating can greatly improve the hardness of hot forging die surface, and reduce the thermal stress of hot forging die surface. Cladding coating has a very good performance of thermal properties.
Keywords :
X-ray diffraction; adhesive bonding; cermets; claddings; forging; hot working; microhardness; nickel compounds; optical microscopy; plasma applications; silicon compounds; thermal stresses; thermomechanical treatment; FeCW6Mo5Cr4V2; Ni-SiC; OPM; X-ray diffractometer; XRD; bonding strength; cermet coating; dynamic thermomechanical analysis; highspeed steel; hot die forging; laser thermal constant tester; metallurgical bonding coating; microhardness; microstructure composition; optical microscopy; plasma cladding; thermal physical parameters; thermal stress reduction; Bonding; Ceramics; Coatings; Forging; Optical microscopy; Plasmas; Steel; Testing; Thermal stresses; X-ray lasers; FGM; Ni60-SiC; hot forging die; plasma cladding; thermal physical parameter;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computing, Control and Industrial Engineering (CCIE), 2010 International Conference on
Conference_Location :
Wuhan
Print_ISBN :
978-0-7695-4026-9
Type :
conf
DOI :
10.1109/CCIE.2010.121
Filename :
5491970
Link To Document :
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