DocumentCode :
2746202
Title :
Flexible opto-electrical interconnect module for consumer electronic application
Author :
Huang, Sheng-Ho ; Lee, Chun-Hsing ; Yeh, Jen-Hao ; Chen, Yuan-Chin ; Huang, Yu-Ming ; Cheng, Fu-Yi ; Hu, Hung-Lien ; Chu, Mu-Tao
Author_Institution :
Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu
fYear :
2008
fDate :
22-24 Oct. 2008
Firstpage :
49
Lastpage :
52
Abstract :
In this paper, we performed a 4 Ch times 2.5 Gbps flexible opto-electrical interconnect module integrated with two silicon optical benchs (SiOBs), four fibers and one rigid-flexible PCB, which provided with capability of optical and electrical data transmission simultaneously. The high-speed data transmission interconnects through fiber, and the electrical transmission interconnects through the circuit of flexible PCB. The SiOB is used for optical coupling between optoelectronics and waveguide, and optical coupling from VCSEL sources to the lightwave circuit is accomplished by 45deg end-mirrors is formed using silicon etching and fibers. A similar optical coupling arrangement is used for the PD array. In this architecture, the assembly tolerances of system are larger than 10 mum. The eye diagram of the electrical output signal from the receiver is tested compliant with SONET OC-48 eye mask.
Keywords :
assembling; data communication; etching; integrated circuit interconnections; integrated optoelectronics; mirrors; modules; optical fibre communication; optical fibre couplers; optical interconnections; optical receivers; surface emitting lasers; 4 Ch times 2.5 Gbps flexible opto-electrical interconnect module; 45deg end-mirrors; Si; VCSEL; assembly; bit rate 2.5 Gbit/s; electrical transmission; etching; high-speed data transmission; lightwave circuit; optical coupling; receiver; rigid-flexible PCB; silicon optical benchs; waveguide; Consumer electronics; Data communication; High speed optical techniques; Integrated circuit interconnections; Integrated optics; Optical coupling; Optical interconnections; Optical receivers; Optical waveguides; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3620-0
Electronic_ISBN :
978-1-4244-3621-7
Type :
conf
DOI :
10.1109/EMAP.2008.4784226
Filename :
4784226
Link To Document :
بازگشت