DocumentCode :
2746222
Title :
A pH Controlled Chemical Mechanical Polishing Method For Ultra-thin Bonded SOI Wafer
Author :
Sugimoto, F. ; Horie, H. ; Arimoto, Y. ; Ito, T.
Author_Institution :
Fujitsu laboratories ltd.
fYear :
1993
fDate :
17-19 May 1993
Firstpage :
113
Lastpage :
114
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, 1993. Digest of Technical Papers. 1993 Symposium on
Conference_Location :
Kyoto, Japan
Type :
conf
DOI :
10.1109/VLSIT.1993.760271
Filename :
760271
Link To Document :
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