DocumentCode
2746238
Title
Low-temperature fabrication method of carbon nanotubes-based gas sensor
Author
Huang, Jung-Tang ; Lin, Chen-Han ; Chang, Po-Chih
Author_Institution
Inst. of Mechatron. Eng., Nat. Taipei Univ. of Technol., Taipei
fYear
2008
fDate
22-24 Oct. 2008
Firstpage
57
Lastpage
60
Abstract
Low temperature processes are the better ways to integrate carbon nanotubes (CNTs) with CMOS chips into array-type gas sensors. Almost the metal used in CMOS is Al-Si-Cu alloy, which make the sustainable temperature of CMOS structures be in the range of 400- 500degC. We offer a new fabrication method of CNTs-based gas sensors at low temperature. The oxidized silicon substrate was modified with 3-aminopropyltriethoxysilane (APTS) to form aminoterminated (-NH2) self-assembled monolayer (SAM) on the surface. The chemical adhesion of CNTs to surface treated is due to the presence of positive charges or amine groups on the surface. After CNTs adhered to SiO2 surface, we deposited interdigitated electrode (IDE) on the SiO2 surface. We experimentally found that the resistances of CNT electronic devices at room temperature typically ranged from several hundreds Omega to several of kOmega, depending on the density of the MWCNTs across the IDE fingers. An array-type CNTs-based gas sensor was made up of many CNTs-based gas sensors. The initial resistance values of these sensors were not the same; therefore we tuned the resistance value of gas sensor equally by trimming.
Keywords
CMOS integrated circuits; carbon nanotubes; gas sensors; monolayers; nanoelectronics; nanofabrication; nanosensors; nanotube devices; self-assembly; sensor arrays; 3-aminopropyltriethoxysilane; C; CMOS chips; SiO2; aminoterminated self-assembled monolayer; array-type gas sensors; carbon nanotubes; chemical adhesion; electronic devices; low-temperature fabrication method; resistances; room temperature; temperature 400 degC to 500 degC; CMOS process; Carbon nanotubes; Chemicals; Fabrication; Gas detectors; Sensor arrays; Silicon; Surface treatment; Temperature distribution; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on
Conference_Location
Taipei
Print_ISBN
978-1-4244-3620-0
Electronic_ISBN
978-1-4244-3621-7
Type
conf
DOI
10.1109/EMAP.2008.4784228
Filename
4784228
Link To Document