Title :
CVD Of Copper From A Cu+1 Precursor And Water Vapor And Formation Of TiN- Encapsulated Submicron Copper Interconnects By Chemical-Mechanical Polishing
Author :
Gelatos ; Poon, S. ; Marsh, R. ; Mogab, C.J. ; Thompson, M.
Author_Institution :
Motorola Inc.
Conference_Titel :
VLSI Technology, 1993. Digest of Technical Papers. 1993 Symposium on
Conference_Location :
Kyoto, Japan
DOI :
10.1109/VLSIT.1993.760279
