DocumentCode

2746342

Title

The Characteristics Of Blanket Copper CVD For Deep Submicron Via Filling

Author

Awaya, N. ; Arita, Y.

Author_Institution

NTT LSI Laboratories

fYear

1993

fDate

17-19 May 1993

Firstpage

125

Lastpage

126

fLanguage

English

Publisher

ieee

Conference_Titel

VLSI Technology, 1993. Digest of Technical Papers. 1993 Symposium on

Conference_Location

Kyoto, Japan

Type

conf

DOI

10.1109/VLSIT.1993.760280

Filename

760280