مرکز منطقه ای اطلاع رساني علوم و فناوري - The Characteristics Of Blanket Copper CVD For Deep Submicron Via Filling

DocumentCode :

2746342

Title :

The Characteristics Of Blanket Copper CVD For Deep Submicron Via Filling

Author :

Awaya, N. ; Arita, Y.

Author_Institution :

NTT LSI Laboratories

fYear :

1993

fDate :

17-19 May 1993

Firstpage :

125

Lastpage :

126

fLanguage :

English

Publisher :

ieee

Conference_Titel :

VLSI Technology, 1993. Digest of Technical Papers. 1993 Symposium on

Conference_Location :

Kyoto, Japan

Type :

conf

DOI :

10.1109/VLSIT.1993.760280

Filename :

760280

Link To Document :