DocumentCode
2746413
Title
Nanoindentation analysis of interfacial IMCs in electronic solder joints
Author
Shen, Yu-Lin ; Song, Jenn-Ming ; Su, Chien-Wei
Author_Institution
Dept. of Mater. Sci. & Eng., Nat. Dong Hwa Univ., Hualien
fYear
2008
fDate
22-24 Oct. 2008
Firstpage
88
Lastpage
90
Abstract
To evaluate the behavior of intermetallic compounds (IMCs) at different loading conditions, this study examined the hardeness and modulus of the IMCs formed at the interfaces between potential Pbfree solders (Sn-Ag-Cu and Sn-Zn) and the substrates of Cu and Ag. Compared to Ag based IMCs, Cu based IMCs are harder, stiffer, but less strain rate sensitive. It is also found that the morphology of the indent impression depends on the ratio of the modulus to hardness, and the crystal structure of the IMCs.
Keywords
copper alloys; crystal structure; elastic moduli; hardness; indentation; silver alloys; solders; tin alloys; zinc compounds; Ag; Cu; SnAgCu; SnZn; crystal structure; electronic solder joints; hardness; interfacial intermetallic compounds; modulus; nanoindentation; strain rate; Soldering; Intermetallic compounds; Nanoindentation; Strain rate sensitivity exponent;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on
Conference_Location
Taipei
Print_ISBN
978-1-4244-3620-0
Electronic_ISBN
978-1-4244-3621-7
Type
conf
DOI
10.1109/EMAP.2008.4784236
Filename
4784236
Link To Document