Title :
Demonstration of chip-scale optical interconnects based on the integration of polymer waveguides and multiple quantum well modulators on silicon
Author :
Nair, Rohit ; Gu, Tian ; Goossen, Keigh W. ; Kiamilev, Fouad ; Haney, Michael W.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Delaware, Newark, DE, USA
Abstract :
Key elements of a multi-material hybrid integration concept for implementing high-density chip-scale optical interconnects are demonstrated. Polymer waveguides with curved facets are used to couple light in and out of the MQW devices flip-chip bonded to silicon.
Keywords :
flip-chip devices; integrated optics; integrated optoelectronics; optical interconnections; optical modulation; optical polymers; optical waveguides; quantum well devices; silicon; MQW devices; Si; chip-scale optical interconnects; flip-chip bonding; multimaterial hybrid integration; multiple quantum well modulators; polymer waveguides; silicon; Detectors; Gallium arsenide; Heat sinks; Metallization; Optical detectors; Silicon;
Conference_Titel :
Photonics Conference (PHO), 2011 IEEE
Conference_Location :
Arlington, VA
Print_ISBN :
978-1-4244-8940-4
DOI :
10.1109/PHO.2011.6110461
