• DocumentCode
    2746587
  • Title

    Demonstration of chip-scale optical interconnects based on the integration of polymer waveguides and multiple quantum well modulators on silicon

  • Author

    Nair, Rohit ; Gu, Tian ; Goossen, Keigh W. ; Kiamilev, Fouad ; Haney, Michael W.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Delaware, Newark, DE, USA
  • fYear
    2011
  • fDate
    9-13 Oct. 2011
  • Firstpage
    133
  • Lastpage
    134
  • Abstract
    Key elements of a multi-material hybrid integration concept for implementing high-density chip-scale optical interconnects are demonstrated. Polymer waveguides with curved facets are used to couple light in and out of the MQW devices flip-chip bonded to silicon.
  • Keywords
    flip-chip devices; integrated optics; integrated optoelectronics; optical interconnections; optical modulation; optical polymers; optical waveguides; quantum well devices; silicon; MQW devices; Si; chip-scale optical interconnects; flip-chip bonding; multimaterial hybrid integration; multiple quantum well modulators; polymer waveguides; silicon; Detectors; Gallium arsenide; Heat sinks; Metallization; Optical detectors; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photonics Conference (PHO), 2011 IEEE
  • Conference_Location
    Arlington, VA
  • Print_ISBN
    978-1-4244-8940-4
  • Type

    conf

  • DOI
    10.1109/PHO.2011.6110461
  • Filename
    6110461
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2746587