Analysis of flip-chip corner delamination using 3-D virtual crack closure technique

The problem of an overmolded flip-chip containing a die-underfill interface corner crack subjected to thermo-mechanical loading is investigated by using finite element simulation. The fracture mechanics parameters including the stress intensity factors and strain energy release rate along the corner crack front are determined by using a three-dimensional virtual crack closure technique. Effect of the interface corner crack shape on the propensity of crack propagation is discussed.