DocumentCode
2746799
Title
Mechanical property measurement of nano-scale metal films on the novel paddle cantilever beams using four step phase-shifting method
Author
Yan-Ting Chen ; Cheng, Va-Chi ; Chung, Kuan-Jung ; Lin, Ming-Tzer
Author_Institution
Dept. of Mechatron. Eng., Nat. Changhua Univ. of Educ., Changhua
fYear
2008
fDate
22-24 Oct. 2008
Firstpage
179
Lastpage
182
Abstract
A test structure with nano-scale metal films, which is deposited on the novel paddle-like cantilever beam, was successfully fabricated and calibrated using standard C-MOS processes. Compared to the traditional cantilevered beam, the 40 mum thickness paddle-like structure provides the uniform stress distribution along the whole beam to decrease the measurement variation. The deflections of argentums, gold, and copper films (50-250 nm) driven by the electrostatic force were measured using four step phase-shifting method. The results present that the test structure and the optical (FSPS) method work properly. Furthermore, argentums presents that the deflection decreases after deposition to demonstrate that the tensile residual stress in the film. Oppositely, gold and copper films show compressive residual stress in them.
Keywords
beams (structures); calibration; cantilevers; copper; gold; internal stresses; mechanical testing; metallic thin films; nanostructured materials; phase shifting interferometry; silver; stress measurement; Ag; Au; Cu; FSPS method; argentum film; calibration; compressive residual stress; copper film; electrostatic force; film deflection; four step phase-shifting method; gold film; mechanical property measurement; nanoscale metal film; optical method; paddle cantilever beam; size 40 mum; size 50 nm to 250 nm; standard C-MOS process; stress distribution; tensile residual stress; test structure; Copper; Electrostatic measurements; Force measurement; Gold; Mechanical factors; Mechanical variables measurement; Optical films; Phase measurement; Structural beams; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on
Conference_Location
Taipei
Print_ISBN
978-1-4244-3620-0
Electronic_ISBN
978-1-4244-3621-7
Type
conf
DOI
10.1109/EMAP.2008.4784258
Filename
4784258
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