• DocumentCode
    2746799
  • Title

    Mechanical property measurement of nano-scale metal films on the novel paddle cantilever beams using four step phase-shifting method

  • Author

    Yan-Ting Chen ; Cheng, Va-Chi ; Chung, Kuan-Jung ; Lin, Ming-Tzer

  • Author_Institution
    Dept. of Mechatron. Eng., Nat. Changhua Univ. of Educ., Changhua
  • fYear
    2008
  • fDate
    22-24 Oct. 2008
  • Firstpage
    179
  • Lastpage
    182
  • Abstract
    A test structure with nano-scale metal films, which is deposited on the novel paddle-like cantilever beam, was successfully fabricated and calibrated using standard C-MOS processes. Compared to the traditional cantilevered beam, the 40 mum thickness paddle-like structure provides the uniform stress distribution along the whole beam to decrease the measurement variation. The deflections of argentums, gold, and copper films (50-250 nm) driven by the electrostatic force were measured using four step phase-shifting method. The results present that the test structure and the optical (FSPS) method work properly. Furthermore, argentums presents that the deflection decreases after deposition to demonstrate that the tensile residual stress in the film. Oppositely, gold and copper films show compressive residual stress in them.
  • Keywords
    beams (structures); calibration; cantilevers; copper; gold; internal stresses; mechanical testing; metallic thin films; nanostructured materials; phase shifting interferometry; silver; stress measurement; Ag; Au; Cu; FSPS method; argentum film; calibration; compressive residual stress; copper film; electrostatic force; film deflection; four step phase-shifting method; gold film; mechanical property measurement; nanoscale metal film; optical method; paddle cantilever beam; size 40 mum; size 50 nm to 250 nm; standard C-MOS process; stress distribution; tensile residual stress; test structure; Copper; Electrostatic measurements; Force measurement; Gold; Mechanical factors; Mechanical variables measurement; Optical films; Phase measurement; Structural beams; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-3620-0
  • Electronic_ISBN
    978-1-4244-3621-7
  • Type

    conf

  • DOI
    10.1109/EMAP.2008.4784258
  • Filename
    4784258