• DocumentCode
    2746831
  • Title

    A new probe card technology using compliant MicrospringsTM

  • Author

    Sporck, Nicholas

  • Author_Institution
    FormFactor Inc., Livermore, CA, USA
  • fYear
    1997
  • fDate
    1-6 Nov 1997
  • Firstpage
    527
  • Lastpage
    532
  • Abstract
    Recent trends in the semiconductor industry such as the widespread use of C4, ever increasing demands for testing more chips in parallel, and faster edge rates, have conspired to present major challenges to currently available probe card technologies. This paper describes a new probe card technology, its characteristics, and how it successfully addresses these challenges
  • Keywords
    aluminium; lead bonding; printed circuit testing; Al; Al pads; C4 probing; FormFactor; Microsprings; PCB; SEM; edge rates; multiple die probing; probe card technology; semiconductor industry; space transformer; Assembly; Bandwidth; Construction industry; Costs; Impedance; Probes; Space technology; Structural beams; Testing; Tungsten;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 1997. Proceedings., International
  • Conference_Location
    Washington, DC
  • ISSN
    1089-3539
  • Print_ISBN
    0-7803-4209-7
  • Type

    conf

  • DOI
    10.1109/TEST.1997.639659
  • Filename
    639659
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2746831