DocumentCode :
2746831
Title :
A new probe card technology using compliant MicrospringsTM
Author :
Sporck, Nicholas
Author_Institution :
FormFactor Inc., Livermore, CA, USA
fYear :
1997
fDate :
1-6 Nov 1997
Firstpage :
527
Lastpage :
532
Abstract :
Recent trends in the semiconductor industry such as the widespread use of C4, ever increasing demands for testing more chips in parallel, and faster edge rates, have conspired to present major challenges to currently available probe card technologies. This paper describes a new probe card technology, its characteristics, and how it successfully addresses these challenges
Keywords :
aluminium; lead bonding; printed circuit testing; Al; Al pads; C4 probing; FormFactor; Microsprings; PCB; SEM; edge rates; multiple die probing; probe card technology; semiconductor industry; space transformer; Assembly; Bandwidth; Construction industry; Costs; Impedance; Probes; Space technology; Structural beams; Testing; Tungsten;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Conference, 1997. Proceedings., International
Conference_Location :
Washington, DC
ISSN :
1089-3539
Print_ISBN :
0-7803-4209-7
Type :
conf
DOI :
10.1109/TEST.1997.639659
Filename :
639659
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2746831
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