Title :
Effect of in addition on Sn-Ag-Sb lead-free solder system
Author :
Lee, Fok-Foo ; Fok-Foo Lee ; Hong, Ting-Fu ; Chen, Hsiao-Wei
Author_Institution :
Dept. of Mech. Eng., Nat. Cheng Kung Univ., Tainan
Abstract :
The present study investigates the effect of 1~5 wt.% Indium additions on microstructure, properties and interfacial IMC´s formation of Sn-3Ag-2Sb(SAS) lead-free solder alloys. Experimental results show that addition of indium results in formation of intermetallic compounds of Ag-Sn-In phase and InSb phase. Sn atoms in Ag3Sn compound formed originally in Sn-Ag solder system are replaced by In atoms in SAS-xIn solder system as indium content is increased. A structural and morphological transformation of Ag3Sn to Ag3(Sn,In), Ag2(Sn,In) and finally to Ag2(In,Sn) is confirmed. Meanwhile, transformation of interfacial Cu6Sn5 IMC layer to Cu6(Sn,In)5 is progressed as the level of In content is increased and accelerated by thermal storage as well.
Keywords :
antimony alloys; crystal microstructure; indium alloys; interface phenomena; silver alloys; solders; solid-state phase transformations; tin alloys; Ag(SnIn); Sn-Ag-Sb; indium additions; interfacial IMC formation; intermetallic compounds; lead-free solder system; microstructure; morphological transformation; structural transformation; thermal storage; Aging; Atomic layer deposition; Environmentally friendly manufacturing techniques; Indium; Lead; Mechanical engineering; Mechanical factors; Microstructure; Optical microscopy; Temperature;
Conference_Titel :
Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3620-0
Electronic_ISBN :
978-1-4244-3621-7
DOI :
10.1109/EMAP.2008.4784261
