DocumentCode :
2747260
Title :
Extraction of micro-contact properties using a novel micromachined on-chip apparatus
Author :
Ben-Hwa Jang ; Tseng, Po-Hsun ; Fang, Weileun ; Lin, Shin-Way
Author_Institution :
Inst. of NEMS
fYear :
2008
fDate :
22-24 Oct. 2008
Firstpage :
285
Lastpage :
288
Abstract :
In this paper we first demonstrated a micromachined device consisting of two chips to characterize the micro-contact properties, such as contact force, film resistance, constriction resistance, and contact surface roughness. Then, based on our unique circuit routing enabling parasitic resistance on chips to be eliminated, the film thickness, the effective contact area radius, and the Ohmic resistance and Sharvin resistance can be further analyzed. In addition, the two chips of the testing device can be disassembled and re-assembled, the interfacial properties can be therefore quantified at different contact cycles (N). Thus, both the qualitative and quantitative relationship among the interfacial properties can be investigated. To demonstrate the feasibility of the present apparatus, the contact characteristics of evaporated Al films were characterized. Potential applications of the present apparatus included a diagnostic tool for tribology and the performance enhancement for RF-MEMS switches and microconnectors.
Keywords :
aluminium; contact resistance; micromechanical devices; ohmic contacts; surface roughness; vacuum deposition; Al; Ohmic resistance; RF-MEMS switches; Sharvin resistance; constriction resistance; contact force; contact surface roughness; diagnostic tool; evaporated films; film resistance; film thickness; interfacial property; microconnectors; microcontact; micromachined on-chip apparatus; parasitic resistance; tribology; unique circuit routing; Circuit testing; Contact resistance; Radiofrequency microelectromechanical systems; Rough surfaces; Routing; Surface resistance; Surface roughness; Switches; Thick film circuits; Tribology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3620-0
Electronic_ISBN :
978-1-4244-3621-7
Type :
conf
DOI :
10.1109/EMAP.2008.4784284
Filename :
4784284
Link To Document :
بازگشت