DocumentCode
2747412
Title
Interconnect architecture exploration for low-energy reconfigurable single-chip DSPs
Author
Zhang, Hui ; Wan, Marlene ; George, Varghese ; Rabaey, Jan
Author_Institution
California Univ., Berkeley, CA, USA
fYear
1999
fDate
1999
Firstpage
2
Lastpage
8
Abstract
In this paper we present and analyze a number of interconnect architectures for reconfigurable systems targeting applications in the areas of wireless communication and multimedia processing. Several interconnect architectures suitable for heterogeneous elements are proposed and then a methodology to evaluate the architectures is described. The results indicate that the hierarchical generalized mesh structure shows the most promise in terms of energy efficiency, as it can optimize both local and global connections
Keywords
digital signal processing chips; integrated circuit design; integrated circuit interconnections; low-power electronics; multimedia communication; reconfigurable architectures; energy efficiency; global connections; heterogeneous elements; hierarchical generalized mesh structure; interconnect architecture exploration; local connections; low-energy reconfigurable single-chip DSPs; multimedia processing; wireless communication; Cost function; Digital signal processing; Displays; Energy consumption; Hardware; Multiprocessor interconnection networks; Network-on-a-chip; Routing; Switches; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI '99. Proceedings. IEEE Computer Society Workshop On
Conference_Location
Orlando, FL
Print_ISBN
0-7695-0152-4
Type
conf
DOI
10.1109/IWV.1999.760456
Filename
760456
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