• DocumentCode
    2747412
  • Title

    Interconnect architecture exploration for low-energy reconfigurable single-chip DSPs

  • Author

    Zhang, Hui ; Wan, Marlene ; George, Varghese ; Rabaey, Jan

  • Author_Institution
    California Univ., Berkeley, CA, USA
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    2
  • Lastpage
    8
  • Abstract
    In this paper we present and analyze a number of interconnect architectures for reconfigurable systems targeting applications in the areas of wireless communication and multimedia processing. Several interconnect architectures suitable for heterogeneous elements are proposed and then a methodology to evaluate the architectures is described. The results indicate that the hierarchical generalized mesh structure shows the most promise in terms of energy efficiency, as it can optimize both local and global connections
  • Keywords
    digital signal processing chips; integrated circuit design; integrated circuit interconnections; low-power electronics; multimedia communication; reconfigurable architectures; energy efficiency; global connections; heterogeneous elements; hierarchical generalized mesh structure; interconnect architecture exploration; local connections; low-energy reconfigurable single-chip DSPs; multimedia processing; wireless communication; Cost function; Digital signal processing; Displays; Energy consumption; Hardware; Multiprocessor interconnection networks; Network-on-a-chip; Routing; Switches; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI '99. Proceedings. IEEE Computer Society Workshop On
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    0-7695-0152-4
  • Type

    conf

  • DOI
    10.1109/IWV.1999.760456
  • Filename
    760456