Title :
Tolerance analysis for embedded passive in organic substrate
Author :
Kim, Taeeui ; Kim, KyungO ; Kim, IIongwon ; Jung, Taesung ; Yi, Sung
Author_Institution :
Samsung Electro-Mech. Co. Ltd., Suwon, South Korea
Abstract :
This paper focuses on design issues brought by tolerance drifts of organic embedded passive technology and their potential effects in RF system applications. The embedded passive technology provides advantage in small form factor for RF modules which are very suitable for miniaturization with promising high level of integration however due to some factors both in the material properties and fabrication processes, their unstable performance especially at high RF is seen as a challenge. Applications operating at high frequency ranges from 1 GHz up to over 5 GHz where at system level there is a critical need for very tight tolerance because of the short wavelength and small geometric dimension. The factors that significantly affect the tolerance are analyzed in this study. Some factors are discussed with measurement data along with validation using simulation tools. This study suggests main issues that should be considered during product development using organic embedded passive technology.
Keywords :
electron device testing; electronics packaging; RF modules; RF system; embedded passive device; fabrication; form factor; miniaturization; organic substrate; tolerance analysis; Costs; Fabrication; Material properties; Microwave technology; Product development; Radio frequency; Substrates; Testing; Tolerance analysis; Wavelength measurement;
Conference_Titel :
Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3620-0
Electronic_ISBN :
978-1-4244-3621-7
DOI :
10.1109/EMAP.2008.4784292