Title : 
A capacitive low-g three-axis accelerometer
         
        
            Author : 
Hsu, Y.W. ; Chien, H.T. ; Lin, C.S. ; Liao, L.P. ; Chen, S. ; Chang, P.
         
        
            Author_Institution : 
Micro Syst. Technol. Center, Ind. Technol. Res. Inst., Tainan
         
        
        
        
        
        
            Abstract : 
This paper presents a compact accelerometer which integrates three spring-proof mass systems on a single structure for sensing three-axis motion in size of 1.3 times 1.28 mm2 for operating range of plusmn 2 g. SOG-bulk micromachining and DRIE are adopted to fabricate this accelerometer with high aspect-ratio sensing structure and high yield. This accelerometer shows excellent z-axis output sensitivity and resolution as high as 1.434 V/g and 49 mug/radic(Hz) respectively. For the performances of in-plane accelerometers, the sensitivity and minimum cross-axis sensitivity are 1.442 V/g and 0.03% for x-axis accelerometer and are 1.241 V/g and 0.21% for y-axis accelerometer. From the characterization, this accelerometer design demonstrates high cross-axis sensitivity immunity, high sensitivity, and good linearity for both in-plane and out-of-plane accelerometers that suggests this three-axis accelerometer to be potential for satisfying the needs of future applications to consumer and cell phone market.
         
        
            Keywords : 
accelerometers; capacitive sensors; springs (mechanical); DRIE; capacitive low-g three-axis accelerometer; cross-axis sensitivity; high aspect-ratio sensing structure; in-plane accelerometers; micromachining; size 1.28 mm; size 1.3 mm; spring-proof mass systems; Accelerometers;
         
        
        
        
            Conference_Titel : 
Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on
         
        
            Conference_Location : 
Taipei
         
        
            Print_ISBN : 
978-1-4244-3620-0
         
        
            Electronic_ISBN : 
978-1-4244-3621-7
         
        
        
            DOI : 
10.1109/EMAP.2008.4784294