DocumentCode
2747511
Title
Organizers & Sponsors
fYear
2008
fDate
22-24 Oct. 2008
Firstpage
337
Lastpage
337
Abstract
Lists the sponsors of this conference.
Keywords
Chemical industry; Chemical technology; Components, packaging, and manufacturing technology; Electronics industry; Plastic packaging; Plastics industry; Printed circuits; Semiconductor device packaging; Societies; Surface-mount technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on
Conference_Location
Taipei
Print_ISBN
978-1-4244-3620-0
Electronic_ISBN
978-1-4244-3621-7
Type
conf
DOI
10.1109/EMAP.2008.4784297
Filename
4784297
Link To Document