• DocumentCode
    2748291
  • Title

    An empirical study on relationship between China´s human capital level and FDI technology spillover: 1985–2009

  • Author

    Hongxia, Zhang ; Lin, Yuan

  • Author_Institution
    Sch. of Econ., Shandong Univ. of Technol., Zibo, China
  • fYear
    2011
  • fDate
    16-17 July 2011
  • Firstpage
    33
  • Lastpage
    37
  • Abstract
    The inspection results of VECM model being aimed at China´s human capital level and FDI technology spillover from 1985 to 2009 show that there is a long-term stable relationship between them. However, the short-term relationship between them is not significant. From the dynamic perspective, the change of FDI technology spillover induces evidently positive effect on human capital level in China, while the effect of change of China´s human capital on FDI technology spillover is relatively weak. Further analysis shows that FDI voluntary technology spillover promotes level of China´s human capital, the overall low level and the less increment of human capital could not accelerate FDI compulsory technology spillover in which the weak influence of human capital on FDI technology spillover is revealed. Based on the above analysis, recommendations are put forward that the policy involved FDI introduction should lean on potential FDI which has more possibility of technology spillover, and secondary education input should be continuously reinforced.
  • Keywords
    international finance; investment; labour resources; macroeconomics; technology management; China; FDI technology spillover; VECM model; error correction model; foreign direct investment; human capital; secondary education; Companies; Economics; Educational institutions; Humans; Investments; Waste materials; Human Capital; Impulse Response; Technology Spillover; VECM Model; Variance Decomposition;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Product Innovation Management (ICPIM), 2011 6th International Conference on
  • Conference_Location
    Wuhan
  • Print_ISBN
    978-1-4577-0359-1
  • Type

    conf

  • DOI
    10.1109/ICPIM.2011.5983596
  • Filename
    5983596