DocumentCode
2748486
Title
Endothelial cell function on a poly(acrylamide-co-polyethylene acid) interpenetrating polymer network: cardiovascular applications
Author
Patel, S.H. ; Tsang, J. ; Harbers, G. ; Healy, K.E. ; Li, S.
Author_Institution
Dept. of Bioengineering, California Univ., Berkeley, CA, USA
Volume
2
fYear
2004
fDate
1-5 Sept. 2004
Firstpage
5040
Lastpage
5043
Abstract
Hydrogel coatings have been widely researched as a nonfouling surface modification of materials for cardiovascular applications. In this study, we examined cell-surface interactions between a poly(acrylamide-copolyethylene glycol/acrylic acid) interpenetrating network (IPN) hydrogel and aortic endothelial cells (ECs). The IPN was covalently attached to polystyrene to form a nanometer scale thick hydrogel, and the IPN layer was activated by conjugation of the cell adhesion peptide Arg-Gly-Asp (RGD). On IPN surfaces lacking the RGD peptide, EC did not adhere and spread even after long-term incubation. The IPN was able to support greater EC adhesion and spreading with increasing RGD surface concentrations. Upon adequate adhesion and spreading, ECs migrated and proliferated at high rates regardless of the RGD surface concentration. These results suggest that this IPN can be used to promote endothelialization of vascular implants made of polymeric and metal materials for cardiovascular applications.
Keywords
adhesion; biomedical materials; cardiovascular system; cellular biophysics; polymer gels; aortic endothelial cells; cardiovascular applications; cell adhesion peptide Arg-Gly-Asp; cell migration; cell proliferation; cell-surface interactions; endothelial cell function; hydrogel coatings; nonfouling surface modification; poly(acrylamide-copolyethylene glycol/acrylic acid) interpenetrating network; polystyrene; Adhesives; Biological materials; Bovine; Cardiology; Peptides; Polymers; Proteins; Protocols; Resists; Surface treatment; IPN; RGD; endothelial cells;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 2004. IEMBS '04. 26th Annual International Conference of the IEEE
Conference_Location
San Francisco, CA
Print_ISBN
0-7803-8439-3
Type
conf
DOI
10.1109/IEMBS.2004.1404393
Filename
1404393
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