• DocumentCode
    2748558
  • Title

    Mechanical properties of bone-implant interface: an in vitro model for the comparison of stability parameters affecting various stages during osseointegration for dental implant

  • Author

    Pan, R.L.-C. ; Ying, S.H.

  • Author_Institution
    Sch. of Medicine, Taipei Med. Univ., Taiwan
  • Volume
    2
  • fYear
    2004
  • fDate
    1-5 Sept. 2004
  • Firstpage
    5050
  • Lastpage
    5052
  • Abstract
    Radiographic examination and palpation have been two of most common the methods often used in clinical assessment for implant stability for years. However, radiographs are two-dimensional and difficult to standardize in dental clinical diagnosis. In current study, an in vitro model for dental implant during osseointegration was designed and tested. To attain optimal healing range prior to frequency measurement, removal torque measurements of the initial as well as plateau mechanical bounding force will be exam for various stiffness of the base materials. Resonance frequency measurements will then be taken at predetermined healing intervals on implants placed in experimental animal. Significance between mechanical stability and increase in resonance frequency will be observed in search of its correlation with the stability of the implant-tissue interface.
  • Keywords
    biomechanics; bone; dentistry; diagnostic radiography; elasticity; patient diagnosis; prosthetics; bone-implant interface; dental clinical diagnosis; dental implant stability; mechanical properties; optimal healing; osseointegration; palpation; plateau mechanical bounding force; radiography; resonance frequency measurements; stiffness; Clinical diagnosis; Dentistry; Diagnostic radiography; Frequency measurement; Implants; In vitro; Mechanical factors; Resonance; Stability; Testing; dental implant; osseointegration; removal torque; stability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2004. IEMBS '04. 26th Annual International Conference of the IEEE
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-8439-3
  • Type

    conf

  • DOI
    10.1109/IEMBS.2004.1404396
  • Filename
    1404396