DocumentCode :
2748999
Title :
An investigation of breakdown in power HEMTs and MESFETs utilising an advanced temperature-dependent physical model
Author :
Albasha, Lutfi ; Johnson, Robert G. ; Snowden, Christopher M. ; Pollard, Roger D.
Author_Institution :
Inst. of Microwaves & Photonics, Leeds Univ., UK
fYear :
1997
fDate :
8-11 Sep 1997
Firstpage :
471
Lastpage :
474
Abstract :
This paper presents a physical model and experimental validation for the breakdown process in HEMTs and MESFETs. The model is integrated into a fast quasi-two-dimensional physical simulation. The model takes account of the tunnelling effects in the region of the gate metallization. A new thermal model monitors the channel temperature and controls the tunnelling mechanism. The effects of the substrate conduction on breakdown in HEMTs is highlighted. Experimental results are presented which confirm the physical interpretations of the numerical model
Keywords :
power HEMT; power MESFET; semiconductor device breakdown; semiconductor device metallisation; semiconductor device models; tunnelling; breakdown; gate metallization; power HEMT; power MESFET; quasi-two-dimensional numerical simulation; substrate conduction; temperature-dependent physical model; thermal model; tunnelling; Electric breakdown; Equations; Gate leakage; HEMTs; MESFETs; MODFETs; Microwave photonics; Temperature; Thermal resistance; Tunneling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Compound Semiconductors, 1997 IEEE International Symposium on
Conference_Location :
San Diego, CA
Print_ISBN :
0-7503-0556-8
Type :
conf
DOI :
10.1109/ISCS.1998.711717
Filename :
711717
Link To Document :
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