DocumentCode
27493
Title
Kinetics of Buffer-Related RON-Increase in GaN-on-Silicon MIS-HEMTs
Author
Bisi, Davide ; Meneghini, Matteo ; Marino, Fabio Alessio ; Marcon, Denis ; Stoffels, Steve ; Van Hove, Marleen ; Decoutere, Stefaan ; Meneghesso, Gaudenzio ; Zanoni, Enrico
Author_Institution
Dept. of Inf. Eng., Univ. of Padova, Padua, Italy
Volume
35
Issue
10
fYear
2014
fDate
Oct. 2014
Firstpage
1004
Lastpage
1006
Abstract
This letter reports an extensive analysis of the charge capture transients induced by OFF-state bias in double heterostructure AlGaN/GaN MIS- high electron mobility transistor grown on silicon substrate. The exposure to OFF-state bias induces a significant increase in the ON-resistance (Ron) of the devices. Thanks to time-resolved on-the-fly analysis of the trapping kinetics, we demonstrate the following relevant results: 1) Ron-increase is temperature- and field-dependent, hence can significantly limit the dynamic performance of the devices at relatively high-voltage and high temperature (100 °C-140 °C) operative conditions; 2) the comparison between OFF-state and back-gating stress indicates that the major contribution to the Ron-increase is due to the trapping of electrons in the buffer, and not at the surface; 3) the observed exponential kinetics suggests the involvement of point-defects, featuring thermally activated capture cross section; and 4) trapping-rate is correlated with buffer vertical leakage-current and is almost independent to gate-drain length.
Keywords
III-V semiconductors; MISFET; aluminium compounds; electron traps; elemental semiconductors; gallium compounds; high electron mobility transistors; leakage currents; point defects; silicon; wide band gap semiconductors; AlGaN-GaN-Si; OFF-state bias; ON-resistance; back-gating stress; buffer vertical leakage current; charge capture transients; double heterostructure MIS-high electron mobility transistor; electron trapping; point defects; temperature 100 degC to 140 degC; trapping kinetics; Aluminum gallium nitride; Charge carrier processes; Gallium nitride; Kinetic theory; Silicon; Stress; Substrates; GaN; HEMT; current collapse; dynamic RON; temperature; temperature.; trapping;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2014.2344439
Filename
6878414
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