Title :
Via design in multi-layer PCB
Author :
Du Meizhu ; Li Shufang ; Qiu Xiaofeng
Author_Institution :
Beijing Univ. of Posts & Telecommun., China
Abstract :
Vias between routing layers induce interconnection discontinuities. Signal reflection on the track is enhanced because of these discontinuities. A via is a noise source as the signal frequency increases. The reflection fraction changes with the via geometry properties, especially via height. The paper focuses on the influence of via height on signal reflection. Via heights from 250 /spl mu/m to 1500 /spl mu/m are studied under high frequency by simulation. The reflection loss caused by a via increases with via height nonlinearly. Considering the reflection, an optimization criterion for via design is provided.
Keywords :
interconnections; printed circuit layout; random noise; reflection; 250 to 1500 micron; interconnection discontinuities; multilayer PCB; noise source; optimization criterion; reflection fraction; routing layers; signal reflection; via design; via geometry; Acoustic reflection; Design optimization; Dielectric materials; Finite difference methods; Frequency; Geometry; Integrated circuit interconnections; Microstrip; Telecommunications; Time domain analysis;
Conference_Titel :
Environmental Electromagnetics, 2003. CEEM 2003. Proceedings. Asia-Pacific Conference on
Conference_Location :
Hangzhou, China
Print_ISBN :
7-5635-0802-3
DOI :
10.1109/CEEM.2003.238594
