Title :
Thermal studies of finned LSI packages under forced convection
Author :
Yokono, Yasuyuki ; Ishizuka, Masaru
Author_Institution :
Toshiba Corp., Kawasaki, Japan
Abstract :
A description is given of extensive computer-based analytical and experimental studies on finned LSI packages, utilizing a cavity-down-type QFP (quad flat package) with 348 pins, in order to examine the simulation method for a high-thermal-performance package and its heat sink. The numerical analysis was accomplished for a conjugate problem, which encompassed flow and heat transfer in the cooling air stream and heat conduction in the package and the heat sink. Experiments were conducted to measure the temperature rise at the junction, the package surface, and the fin, using several kinds of omnidirectional heat sink fins in a wind tunnel. The applicability of the model used for the simulation and the computational scheme were verified by comparing the experimental results with those obtained on the basis of the model. The comparisons indicate that the proposed numerical method for obtaining the thermal resistance is satisfactory for thermal design.<>
Keywords :
computer aided analysis; convection; cooling; electronic engineering computing; heat sinks; integrated circuit technology; large scale integration; numerical analysis; packaging; thermal resistance; wind tunnels; cavity down type package; computer aided analysis; cooling air stream; finned LSI packages; flow transfer; forced convection; heat conduction; heat transfer; numerical analysis; omnidirectional heat sink fins; package surface; quad flat package; simulation; thermal design; thermal resistance; wind tunnel; Analytical models; Computational modeling; Electronics packaging; Heat sinks; Heat transfer; Large scale integration; Pins; Temperature measurement; Thermal force; Thermal resistance;
Conference_Titel :
Semiconductor Thermal and Temperature Measurement Symposium, 1989. SEMI-THERM V., Fifth Annual IEEE
Conference_Location :
San Diego, CA, USA
DOI :
10.1109/STHERM.1989.76060
