Title :
Design for Environment in New Semiconductor Manufacturing Technologies
Author :
Harland, John ; Harman, David ; Drago, Len
Author_Institution :
Intel Corp., Hillsboro
Abstract :
In this paper, we provide data on the environmental performance improvements achieved during the conversion from manufacturing semiconductors on 200 mm silicon wafer to manufacturing on 300 mm. Conclusions identify approaches to continue the environmental improvements in future manufacturing generations.
Keywords :
design for environment; environmental management; integrated circuit manufacture; design for environment; environmental performance improvements; future manufacturing generations; semiconductor manufacturing technologies; silicon wafer; size 200 mm; size 300 mm; Manufacturing industries; Manufacturing processes; Microprocessors; Moore´s Law; Production facilities; Pulp manufacturing; Research and development; Semiconductor device manufacture; Silicon; Water conservation; 300mm wafer; Environmental performance; Silicon wafer; emission factor; microprocessor; semiconductor tools; water conservation;
Conference_Titel :
Electronics & the Environment, Proceedings of the 2007 IEEE International Symposium on
Conference_Location :
Orlando, FL
Print_ISBN :
1-4244-0861-X
DOI :
10.1109/ISEE.2007.369373
