Title :
Quantification of thermal contact conductance in electronic packages
Author :
Childres, S. ; Peterson, G.P.
Author_Institution :
Dept. of Mech. Eng., Texas A&M Univ., College Station, TX, USA
Abstract :
Results of an investigation are presented in which a numerical technique was used to predict interface pressures. Combining these predicted pressures and the results of previous investigations, the individual thermal contact resistances and overall package resistance were determined for an 18 plastic dual-in-line package (PDIP) constructed from typical, commercially available materials. The results indicate that the summation of the contact resistances can comprise as much as 43% of the total package thermal resistance for the packages investigated.<>
Keywords :
contact resistance; finite element analysis; numerical methods; packaging; contact resistances; electronic packages; finite element model; interface pressures; numerical technique; package resistance; plastic dual-in-line package; thermal contact conductance; Conducting materials; Contact resistance; Electronic packaging thermal management; Heat transfer; Lead; Semiconductor device packaging; Surface resistance; Thermal conductivity; Thermal engineering; Thermal resistance;
Conference_Titel :
Semiconductor Thermal and Temperature Measurement Symposium, 1989. SEMI-THERM V., Fifth Annual IEEE
Conference_Location :
San Diego, CA, USA
DOI :
10.1109/STHERM.1989.76062
